Thermal and Plasma Treatments for Improved (Sub-)1nm EOT Planar and FinFET-based RMG High-k Last Devices and Enabling a Simplified Scalable CMOS Integration Scheme
A. Veloso(IMEC), Naoto Horiguchi(IMEC), T. Schram(IMEC), Hiroaki Arimura(IMEC), E. Vecchio(IMEC), M.J. Cho, Farid Sebaai(IMEC), Eddy Simoen(IMEC), L.-Å. Ragnarsson(IMEC), T. Witters(IMEC), S. Brus(University of Liège), Thierry Conard(IMEC), Vasile Paraschiv(IMEC), Xiusong Shi, K. Devriendt(IMEC), Aaron Thean(National University of Singapore), Ph. Roussel(IMEC), A. Van Ammel, Yuichi Higuchi(Panasonic (Japan)), J.W. Lee, Kristof Kellens(IMEC), I. Vaesen(IMEC), N. Heylen(IMEC), H. Bender(IMEC), Harold Dekkers(IMEC), G. Boccardi(IMEC), Raja Athimulam(IMEC), Olivier Richard(IMEC), Soon Aik Chew(IMEC), Aayushi Dangol(IMEC)
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