Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS TransistorsJieming Pan, Aaron Thean, Jin Feng Leong et al.|ACS Applied Nano Materials|2021Cited by 46
Physical Insights into Vacancy-Based Memtransistors: Toward Power Efficiency, Reliable Operation, and ScalabilityMaheswari Sivan, Aaron Thean, Jin Feng Leong et al.|ACS Nano|2022Cited by 30
Significance of activation functions in developing an online classifier for semiconductor defect detectionMd Meftahul Ferdaus, J. Senthilnath, Bangjian Zhou et al.|Knowledge-Based Systems|2022Cited by 14
Bridge-Defect Prediction in SRAM Circuits Using Random Forest, XGBoost, and LightGBM LearnersJoydeep Ghosh, Aaron Thean, Shang Yi Lim|Unknown|2021Cited by 5
Innovative use of TCAD Process Simulation for Device Failure AnalysisShang Yi Lim, Aaron Thean, Joydeep Ghosh|Unknown|2021Cited by 5