Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme
A. Veloso(IMEC), Naoto Horiguchi(IMEC), Hiroaki Arimura(IMEC), E. Vecchio(IMEC), Farid Sebaai(IMEC), Eddy Simoen(IMEC), T. Witters(IMEC), S. Brus(University of Liège), Thierry Conard(IMEC), Vasile Paraschiv(IMEC), K. Devriendt(IMEC), A. Van Ammel, Yuichi Higuchi(Panasonic (Japan)), Kristof Kellens(IMEC), I. Vaesen(IMEC), Philippe Roussel(IMEC), N. Heylen(IMEC), H. Bender(IMEC), Harold Dekkers(IMEC), T. Chiarella(IMEC), G. Boccardi(IMEC), Raja Athimulam(IMEC), Jae Wook Lee(Korea Advanced Institute of Science and Technology), Lars‐Åke Ragnarsson(IMEC), Moon Ju Cho(IMEC), Soon Aik Chew(IMEC), Aaron Thean(IMEC), Anish Dangol(IMEC), Olivier Richard(IMEC), Xiaoping Shi(IMEC), T. Schram(IMEC)
Unknown
January 1, 2013
Cited by 0
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