Novel process to pattern selectively dual dielectric capping layers using soft-mask only
T. Schram(IMEC), S. Biesemans(IMEC), Moonju Cho(IMEC), A. Lauwers(IMEC), M. Aoulaiche(IMEC), L.-Å. Ragnarsson(IMEC), Rita Vos(IMEC), T. Witters(IMEC), S. Brus(University of Liège), Vincent S. Chang(IMEC), T. Kauerauf(IMEC), Prasad Kelkar(IMEC), Vasile Paraschiv(IMEC), A. Delabie(IMEC), C. Vrancken(IMEC), E. Röhr(IMEC), J.C. Hooker(NXP (Belgium)), Christoph Adelmann(Imec the Netherlands), Shu-Cheng Chang, T. Chiarella(IMEC), H.-J. Cho(IMEC), P. Absil(IMEC), Stefan Kubicek(Austrian Academy of Sciences), R. Mitsuhashi(Panasonic (China)), A. Akheyar(IMEC), T. Y. Hoffmann(IMEC), Monique Ercken(IMEC), Y. Okuno, K. De Meyer(IMEC), C. Kerner(IMEC)
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