Process control & integration options of RMG technology for aggressively scaled devices
A. Veloso(IMEC), Naoto Horiguchi(IMEC), J. del Agua Borniquel(Applied Materials (United States)), E. Vecchio(IMEC), Xiaodong Shi(Beijing Anding Hospital), Anup Phatak(Applied Materials (United States)), Hilde Tielens(IMEC), Kun Xu(Applied Materials (United States)), Farid Sebaai(IMEC), Eddy Simoen(IMEC), M Allen(Applied Materials (United States)), S. Brus(University of Liège), Vasile Paraschiv(IMEC), M. J. Cho(IMEC), K. Devriendt(IMEC), A. Van Ammel, Paola Favia(IMEC), C. Liu(Applied Materials (United States)), Yuichi Higuchi(Panasonic (Japan)), E. Röhr(IMEC), Woo Sik Yoo(IMEC), Y. Crabbe(IMEC), Kristof Kellens(IMEC), H. Bender(IMEC), Tingting Xu(Peking University), Geert Eneman(Research Foundation - Flanders), Harold Dekkers(IMEC), A. Thean(IMEC), Lars‐Åke Ragnarsson(IMEC), J. Geypen(IMEC), Soon Aik Chew(IMEC), T. Schram(IMEC)
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