Strain enhanced FUSI/HfSiON Technology with optimized CMOS Process Window
A. Veloso(IMEC), S. Biesemans(IMEC), C. Kerner(IMEC), Jean‐François de Marneffe(IMEC), S. Locorotondo(IMEC), M. Jurczak(IMEC), Danny Goossens(IMEC), A. Lauwers(IMEC), Rita Vos(IMEC), Bart Onsia, S. Brus(University of Liège), D. Baute(IMEC), Thierry Conard(IMEC), Vasile Paraschiv(IMEC), Thomas Hoffmann(IMEC), C. Vrancken(IMEC), M. Niwa, H.Y. Yu(IMEC), Sophia Arnauts(IMEC), Peter Verheyen(IMEC), Shu-Cheng Chang, T. Chiarella(IMEC), J. A. Kittl(IMEC), Barry O’Sullivan(Toshiba (Japan)), S. Mertens(IMEC), P. Absil(IMEC), R. Mitsuhashi(Panasonic (China)), Roger Loo(IMEC), S. Ito(IMEC), Xiaodong Shi(Beijing Anding Hospital)
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