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Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integrationZhong-Jie Hong, Kuan‐Neng Chen, Chih-Han Chen et al.|Applied Surface Science|2022Cited by 38
Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon ViaYi-Chieh Tsai, Kuan‐Neng Chen, Chia-Hsuan Lee et al.|IEEE Transactions on Electron Devices|2021Cited by 19
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and PackagingZhong-Jie Hong, Kuan‐Neng Chen, Demin Liu et al.|2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)|2022Cited by 9
Single-Crystal Islands (SCI) for Monolithic 3-D and Back-End-of-Line FinFET CircuitsYuwei Liu, Chenming Hu, Hanwen Hu et al.|IEEE Transactions on Electron Devices|2021Cited by 8