Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)Hanwen Hu, Kuan‐Neng Chen|Microelectronics Reliability|2021Cited by 130
Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layerZhong-Jie Hong, Kuan‐Neng Chen, Chih-I Cho et al.|Applied Surface Science|2022Cited by 76
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D IntegrationTzu-Chieh Chou, Kuan‐Neng Chen, Tao‐Chih Chang et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2020Cited by 65
Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au PassivationDemin Liu, Kuan‐Neng Chen, Hanwen Hu et al.|IEEE Journal of the Electron Devices Society|2021Cited by 61
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D IntegrationDemin Liu, Kuan‐Neng Chen, Tsung-Yi Kuo et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2021Cited by 52