Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging
Zhong-Jie Hong(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Shu-Ting Hsieh(National Yang Ming Chiao Tung University), Jui-Han Liu(National Yang Ming Chiao Tung University), Demin Liu(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Ming-Wei Weng(National Yang Ming Chiao Tung University), Chih-I Cho(National Yang Ming Chiao Tung University)
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
June 12, 2022
Cited by 9
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