Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
Zhong-Jie Hong(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Jui-Han Liu(National Yang Ming Chiao Tung University), Demin Liu(National Yang Ming Chiao Tung University), Ming-Wei Weng(National Yang Ming Chiao Tung University), Chih-I Cho(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University)
Cited by 76
Related Papers
Developing Ni single-atom sites in carbon nitride for efficient photocatalytic H2O2 production
|Nature Communications|2023|454
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)
|Microelectronics Reliability|2021|130
Wrinkled 2D Materials: A Versatile Platform for Low‐Threshold Stretchable Random Lasers
|Advanced Materials|2017|105
Persulfate enhanced photocatalytic degradation of bisphenol A over wasted batteries-derived ZnFe2O4 under visible light
|Journal of Cleaner Production|2020|85
Hydrogenation of CO<sub>2</sub> to Light Olefins over ZnZrO<sub>x</sub>/SSZ‐13
|Angewandte Chemie International Edition|2024|69