Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D IntegrationDemin Liu, Kuan‐Neng Chen, Ying-Ting Chung et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2021Cited by 52
Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal LayersDemin Liu, Kuan‐Neng Chen, Po‐Chih Chen et al.|IEEE Electron Device Letters|2021Cited by 29
Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous IntegrationTzu-Chieh Chou, Kuan‐Neng Chen, Kai-Ming Yang et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2020Cited by 21
Single-Crystal Islands (SCI) for Monolithic 3-D and Back-End-of-Line FinFET CircuitsYuwei Liu, Chenming Hu, Kuan‐Neng Chen et al.|IEEE Transactions on Electron Devices|2021Cited by 8