Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With PassivationYi-Chieh Tsai, Kuan‐Neng Chen, Hanwen Hu|IEEE Electron Device Letters|2020Cited by 36
Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon ViaYi-Chieh Tsai, Kuan‐Neng Chen, Chia-Hsuan Lee et al.|IEEE Transactions on Electron Devices|2021Cited by 19
Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS ApplicationYu‐Ting Huang, Kuan‐Neng Chen, Yi-Chieh Tsai et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2022Cited by 8
Investigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct BondingDemin Liu, Kuan‐Neng Chen, Yi-Chieh Tsai et al.|2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)|2022Cited by 7
Hybrid Soldering 2.3D Assembly With High Reliability and Low CostHanwen Hu, Kuan‐Neng Chen, Yu-Wei Huang et al.|IEEE Journal of the Electron Devices Society|2022Cited by 6