Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Zhong-Jie Hong(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Mu-Ping Hsu(Industrial Technology Research Institute), Chien-Kang Hsiung(National Yang Ming Chiao Tung University), Ying-Chan Hung, Chih-I Cho(National Yang Ming Chiao Tung University), Chih-Han Chen(National Yang Ming Chiao Tung University), Jui-Han Liu(National Yang Ming Chiao Tung University), Demin Liu(Hebei Medical University), Ming-Wei Weng(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University)
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