Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPsJianxiong Yang, Muzixiang Xiao, Yanbo Che et al.|IEEE Transactions on Device and Materials Reliability|2021Cited by 30
In-Situ Monitoring Solder Layer Degradation in Multichip IGBT Power Modules Using Auxiliary Emitter VoltageJianxiong Yang, Mingxing Du, Yanbo Che et al.|IEEE Transactions on Power Electronics|2024Cited by 7
Junction temperature estimation approach based on TSEPs in multichip IGBT modulesJianxiong Yang, Mingxing Du, Li Ran et al.|Journal of Power Electronics|2022Cited by 7
In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe TechnologyMingxing Du, Jinling Yin, Shaoxiang Wang et al.|IEEE Transactions on Instrumentation and Measurement|2025Cited by 3
In Situ Monitoring of Maximum and Average Chip Junction Temperature Within Multichip IGBT Power Modules Using Kelvin Emitter VoltageJianxiong Yang, Mingxing Du, Li Ran et al.|IEEE Journal of Emerging and Selected Topics in Power Electronics|2025Cited by 2