Junction temperature estimation approach based on TSEPs in multichip IGBT modules
Jianxiong Yang(Tianjin University of Technology), Mingxing Du(Tianjin University of Technology), Borong Hu(University of Cambridge), Yanbo Che(Tianjin University), Li Ran(Durham University)
Cited by 7
Related Papers
Development of a prototype solid-state fault-current limiting and interrupting device for low-voltage distribution networks
|IEEE Transactions on Power Delivery|2006|70
Harmonic analysis and improvement of a new solid-state fault current limiter
|IEEE Transactions on Industry Applications|2004|42
Demand Response From the Control of Aggregated Inverter Air Conditioners
|IEEE Access|2019|40
Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs
|IEEE Transactions on Device and Materials Reliability|2021|30