Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPsJianxiong Yang, Muzixiang Xiao, Li Ran et al.|IEEE Transactions on Device and Materials Reliability|2021Cited by 30
Evaluation of Frequency and Temperature Dependence of Power Losses Difference in Parallel IGBTsJianxiong Yang, Huaping Jiang, Li Ran et al.|IEEE Access|2020Cited by 23
Technological advancements and future prospects of electrical power systems for sustainable more electric aircraftJianxiong Yang, Yanbo Che|Propulsion and Power Research|2024Cited by 12
Junction temperature estimation approach based on TSEPs in multichip IGBT modulesJianxiong Yang, Mingxing Du, Yanbo Che et al.|Journal of Power Electronics|2022Cited by 7