In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe Technology
Mingxing Du(Tianjin University of Technology), Jinling Yin(Tianjin University of Technology), Shaoxiang Wang(Tianjin University of Technology), Jianxiong Yang(Tianjin University of Technology)
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