In Situ Monitoring of Maximum and Average Chip Junction Temperature Within Multichip IGBT Power Modules Using Kelvin Emitter Voltage
Jianxiong Yang(Tianjin University of Technology), Mingxing Du(Tianjin University of Technology), Yanbo Che(Tianjin University), Li Ran(Durham University)
IEEE Journal of Emerging and Selected Topics in Power Electronics
March 26, 2025
Cited by 2
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