Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs
Jianxiong Yang(Tianjin University of Technology), Muzixiang Xiao(University of Bristol), Yanbo Che(Tianjin University), Mingxing Du(Tianjin University of Technology), Huaping Jiang(Chongqing University), Li Ran(Durham University)
Cited by 30
Related Papers
Development of a prototype solid-state fault-current limiting and interrupting device for low-voltage distribution networks
|IEEE Transactions on Power Delivery|2006|70
Harmonic analysis and improvement of a new solid-state fault current limiter
|IEEE Transactions on Industry Applications|2004|42
Demand Response From the Control of Aggregated Inverter Air Conditioners
|IEEE Access|2019|40
Evaluation of Frequency and Temperature Dependence of Power Losses Difference in Parallel IGBTs
|IEEE Access|2020|23
Power quality improvement using a solid-state fault current limiter
|IEEE PES Transmission and Distribution Conference and Exhibition|2002|17