Influence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
L. Goux(IMEC), J. A. Kittl(IMEC), D. J. Wouters(IMEC), Christophe Detavernier(Ghent University Hospital), M. Jurczak(IMEC), Karl Opsomer(IMEC), R. Degraeve(IMEC), Robert Müller(IMEC), L. Altimime(IMEC)
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