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Development and characterization of a through-multilayer TSV integrated SRAM moduleYunhui Zhu, Yufeng Jin, Runiu Fang et al.|Unknown|2013Cited by 9
Understanding effect of additives in copper electroplating filling for through silicon viaMin Miao, Yufeng Jin, Yunhui Zhu et al.|Unknown|2012Cited by 2
Process development of a stacked chip module with TSV interconnectionXiaoxia Zhong, Yufeng Jin, Shenglin Ma et al.|Unknown|2012Cited by 1
Development of a through-stack-via integrated SRAM moduleYunhui Zhu, Yufeng Jin, Xin Gong et al.|Unknown|2012Cited by 0