Process development of a stacked chip module with TSV interconnection
Xiaoxia Zhong(Shanghai Jiao Tong University), Yufeng Jin(Peking University), Yuan Bian(Peking University), Shenglin Ma(Xiamen University), Yunhui Zhu(Peking University), Qinghu Cui(Peking University Shenzhen Hospital), Min Miao(Information Technology Institute), Xin Sun(Peking University), Jing Chen(Shanghai Jiao Tong University)
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