Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration
Xin Sun(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Jing Chen(Shanghai Jiao Tong University), Xiaoxia Zhong(Shanghai Jiao Tong University), Runiu Fang(Peking University), Yong Guan(Peking University), Yunhui Zhu(Peking University), Yuan Bian(Peking University), Min Miao(Information Technology Institute)
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