Development and characterization of a through-multilayer TSV integrated SRAM module
Yunhui Zhu(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Runiu Fang(Peking University), Min Miao(Information Technology Institute), Jing Chen(Shanghai Jiao Tong University), Xiaoxia Zhong(Shanghai Jiao Tong University), Yuan Bian(Peking University), Shenglin Ma(Xiamen University), Chen Meng(Northeast Normal University), Xin Sun(Peking University), Wengao Lu(Peking University)
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