Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integrationXin Sun, Yufeng Jin, Runiu Fang et al.|Microelectronic Engineering|2015Cited by 26
Development and characterization of a through-multilayer TSV integrated SRAM moduleYunhui Zhu, Yufeng Jin, Shenglin Ma et al.|Unknown|2013Cited by 9
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP ProcessYong Guan, Yufeng Jin, Yunhui Zhu et al.|IEEE Transactions on Semiconductor Manufacturing|2016Cited by 9
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip IntegrationYong Guan, Yufeng Jin, Shenglin Ma et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2017Cited by 4
Wafer level Tungsten-Glass bonding with photosensitive BCBYi Shan, Yufeng Jin, Nannan Li et al.|Unknown|2012Cited by 2