Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layerZhong-Jie Hong, Kuan‐Neng Chen, Demin Liu et al.|Applied Surface Science|2022Cited by 76
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integrationZhong-Jie Hong, Kuan‐Neng Chen, Ming-Wei Weng et al.|Applied Surface Science|2022Cited by 38
Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding StructureZhong-Jie Hong, Kuan‐Neng Chen, Ming-Wei Weng et al.|IEEE Electron Device Letters|2023Cited by 21
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and PackagingZhong-Jie Hong, Kuan‐Neng Chen, Demin Liu et al.|2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)|2022Cited by 9
Asymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation LayerMing-Wei Weng, Kuan‐Neng Chen, Shan-Yu Mao et al.|Unknown|2021Cited by 6