Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure
Zhong-Jie Hong(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Ying-Chan Hung, Chih-Han Chen(National Yang Ming Chiao Tung University), Tai‐Yu Lin(National Cheng Kung University), Hanwen Hu(North Sichuan Medical University), Ming-Wei Weng(National Yang Ming Chiao Tung University), Mu-Ping Hsu(Industrial Technology Research Institute)
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