Asymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation Layer
Ming-Wei Weng(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Demin Liu(Hebei Medical University), Hanwen Hu(North Sichuan Medical University), Shan-Yu Mao(National Yang Ming Chiao Tung University)
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