Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration
Yong Guan(Peking University), Yufeng Jin(Peking University Shenzhen Hospital), Jing Chen(Shanghai Jiao Tong University), Shenglin Ma(Xiamen University), Yunhui Zhu(Peking University), Qinghua Zeng(Peking University)
IEEE Transactions on Components Packaging and Manufacturing Technology
May 12, 2017
Cited by 4
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