Wafer level Tungsten-Glass bonding with photosensitive BCB

Yi Shan(HBIS (China)), Yufeng Jin(Peking University), Yiming Zhang(Peking University), Nannan Li(Sichuan University), Jin Luo(Peking University), Suhui Chen(Peking University), Jia Hu(Wuhan University of Science and Technology), Yunhui Zhu(Peking University), Jing Chen(Shanghai Jiao Tong University)
Unknown
August 1, 2012
Cited by 2


Related Papers