Wafer level Tungsten-Glass bonding with photosensitive BCB
Yi Shan(HBIS (China)), Yufeng Jin(Peking University), Yiming Zhang(Peking University), Nannan Li(Sichuan University), Jin Luo(Peking University), Suhui Chen(Peking University), Jia Hu(Wuhan University of Science and Technology), Yunhui Zhu(Peking University), Jing Chen(Shanghai Jiao Tong University)
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