Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D IntegrationTzu-Chieh Chou, Kuan‐Neng Chen, Shin‐Yi Huang et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2020Cited by 65
Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au PassivationDemin Liu, Kuan‐Neng Chen, Po‐Chih Chen et al.|IEEE Journal of the Electron Devices Society|2021Cited by 61
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D IntegrationDemin Liu, Kuan‐Neng Chen, Yuwei Liu et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2021Cited by 52
Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding ApplicationsTzu‐Heng Hung, Kuan‐Neng Chen, Ting-Cih Kang et al.|Unknown|2021Cited by 27
Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous IntegrationTzu-Chieh Chou, Kuan‐Neng Chen, Kai-Ming Yang et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2020Cited by 21