Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration
Demin Liu(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Tzu-Chieh Chou(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Zhong-Jie Hong(National Yang Ming Chiao Tung University), Yuwei Liu(National Yang Ming Chiao Tung University), Tsung-Yi Kuo(National Yang Ming Chiao Tung University), Ying-Ting Chung(National Yang Ming Chiao Tung University)
IEEE Transactions on Components Packaging and Manufacturing Technology
March 26, 2021
Cited by 52
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