Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Tzu-Chieh Chou(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Jian-Chen Li(National Yang Ming Chiao Tung University), Kai-Ming Yang(Shenzhen University), Tzyy-Jang Tseng, Yuhua Chen(Micron Corporation (United States)), Yuwei Liu(National Yang Ming Chiao Tung University), Cheng-Ta Ko, Hanwen Hu(North Sichuan Medical University), Ting-Yang Yu(National Yang Ming Chiao Tung University), Yu-Tao Yang(Shanxi University)
IEEE Transactions on Components Packaging and Manufacturing Technology
June 25, 2020
Cited by 21
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