Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration
Tzu-Chieh Chou(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Chih‐Wei Chang(National Yang Ming Chiao Tung University), Pin-Jun Chen(National Yang Ming Chiao Tung University), Chao‐Jung Chen(Integrated Chinese Medicine (China)), Tzu-Hsuan Ni(Industrial Technology Research Institute), Yu-Min Lin(Industrial Technology Research Institute), Shin‐Yi Huang(Industrial Technology Research Institute), Demin Liu(Hebei Medical University), Tao‐Chih Chang(Industrial Technology Research Institute), Hanwen Hu(North Sichuan Medical University)
IEEE Transactions on Components Packaging and Manufacturing Technology
November 11, 2020
Cited by 65
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