Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation
Demin Liu(Hebei Medical University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Tzu-Chieh Chou(National Yang Ming Chiao Tung University), Po‐Chih Chen(National Yang Ming Chiao Tung University)
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