20:1 projection soft x-ray lithography using trilevel resist
T. E. Jewell(AT&T (United States)), John H. Bruning, L. H. Szeto(AT&T (United States)), Jeffrey Bokor(Berkeley College), M. L. O’Malley(AT&T (United States)), L. Eichner(AT&T (United States)), Marco Becker(AT&T (United States)), Alastair A. MacDowell(AT&T (United States)), David L. Windt(Reflective X Ray Optics), W. K. Waskiewicz(AT&T (United States)), D. M. Tennant(University of Tennessee at Knoxville), J. E. Bjorkholm(AT&T (United States)), W. T. Silfvast(AT&T (United States)), R. R. Freeman(AT&T (United States)), Obert R. Wood(AT&T (United States)), W Mansfield(AT&T (United States)), D. L. White(AT&T (United States)), E. L. Raab(AT&T (United States))
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
May 1, 1990
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