Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation

Yi-Chieh Tsai(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University)
IEEE Electron Device Letters
June 9, 2020
10.1109/led.2020.3001163
Cited by 36

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