Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS Application
Yu‐Ting Huang(National Cheng Kung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Yi‐Cheng Huang(National Taiwan University), Yi-Chieh Tsai(National Yang Ming Chiao Tung University)
IEEE Transactions on Components Packaging and Manufacturing Technology
December 26, 2022
Cited by 8
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