Investigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct Bonding
Demin Liu(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Kuan-Chun Mei(National Yang Ming Chiao Tung University), Yi-Chieh Tsai(National Yang Ming Chiao Tung University), Huang-Chung Cheng(National Yang Ming Chiao Tung University)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
May 1, 2022
Cited by 7
Related Papers
Developing Ni single-atom sites in carbon nitride for efficient photocatalytic H2O2 production
|Nature Communications|2023|454
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)
|Microelectronics Reliability|2021|130
Wrinkled 2D Materials: A Versatile Platform for Low‐Threshold Stretchable Random Lasers
|Advanced Materials|2017|105
Persulfate enhanced photocatalytic degradation of bisphenol A over wasted batteries-derived ZnFe2O4 under visible light
|Journal of Cleaner Production|2020|85
Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
|Applied Surface Science|2022|76