Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature StorageJohn Osenbach, R. Weachock, J. Goodell et al.|Journal of Electronic Materials|2008Cited by 13
Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packagesJohn Osenbach, D. L. Crouthamel, Sue Emerich et al.|Unknown|2014Cited by 2
Method for improved thermal performance of flip chip on flex power devicesB.T. Vaccaro, Ebyson Thomas, John Osenbach et al.|Unknown|2008Cited by 2
Thermal degradation of sputtered Al/Ni(V)/Cu-UBM in Pb-free flip chip solder joints connected to substrate with different surface finishesJohn Osenbach, F. A. Baiocchi, R. Weachock et al.|Unknown|2008Cited by 1