Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature StorageJohn Osenbach, R. Weachock, D. Bitting et al.|Journal of Electronic Materials|2008Cited by 13
Thermal degradation of sputtered Al/Ni(V)/Cu-UBM in Pb-free flip chip solder joints connected to substrate with different surface finishesJohn Osenbach, F. A. Baiocchi, M. Bachman et al.|Unknown|2008Cited by 1