Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAsR.L. Shook, Daniel Gerlach, A. Dairo et al.|Unknown|2004Cited by 11
Method for improved thermal performance of flip chip on flex power devicesB.T. Vaccaro, Ebyson Thomas, John Osenbach et al.|Unknown|2008Cited by 2