Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packages
John Osenbach, D. L. Crouthamel(AT&T (United States)), S. Cate, Jeong M. Dang(Kyocera (United States)), Seung Min Hwang(Amkor Technology (United States)), Danny Brady(Amkor Technology (United States)), Sue Emerich
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