D. L. Crouthamel

AT&T (United States)

Publishes on Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Mechanical Behavior of Composites. 12 papers and 263 citations.

PubIndex Score3Top 97% · seniorHow it's scored

12Publications

263Total Citations

First publication: 1984

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Mechanical Behavior of Composites Injection Molding Process and Properties Fluid Dynamics and Thin Films

Top publicationsby citations

Residual Stress Development in the Injection Molding of Polymers

А. I. Isayev, D. L. Crouthamel|Polymer-Plastics Technology and Engineering|1984

Cited by 114

Thermomechanical properties of 1C molding compounds

H. E. Bair, D. L. Crouthamel, D. J. Boyle et al.|Polymer Engineering and Science|1990

Cited by 50

The impact of moisture in mold compound preforms on the warpage of PBGA packages

T.Y. Lin, Yi Ma, B. Njoman et al.|Microelectronics Reliability|2003

Cited by 29

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Spring H. Han, D. L. Crouthamel, K. K. Wang|Journal of Electronic Packaging|1997

Cited by 22

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

John Osenbach, R. Weachock, A. Amin et al.|Journal of Electronic Materials|2008

Cited by 13