Thermal degradation of sputtered Al/Ni(V)/Cu-UBM in Pb-free flip chip solder joints connected to substrate with different surface finishes
John Osenbach, F. A. Baiocchi, R. Weachock, D. L. Crouthamel(AT&T (United States)), M. Bachman, A. Amin(University of Maryland, College Park), J. M. DeLucca
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