Warpage and Thermal Characterization of Fan-Out Wafer-Level PackagingJohn H. Lau, Xi Cao, Eric Kuah et al.|Unknown|2017Cited by 44
Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2018Cited by 25