Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau(ASM Pacific Technology (China)), Qingxiang Yong(Huawei Technologies (China)), Koh Sau Wee(Huawei Technologies (China)), Henry Yang, Ning Cheng Lee(Indium Corporation (United States)), Kai Wu(King University), Yiu‐ming Cheung(Hong Kong Baptist University), Xi Cao(Huawei Technologies (China)), Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Rozalia Beica(Dow Chemical (United States)), Dewen Tian(ASM Pacific Technology (China)), Margie Li(ASM Pacific Technology (China)), Yuhua Chen(Stomatology Hospital), Zhang Li, Ming Li(ASM Pacific Technology (China)), Nelson Fan(ASM Pacific Technology (China)), Cheng-Ta Ko, K. H. Tan, Thomas A. Taylor(Dow Chemical (United States)), J Y Hao(ASM Pacific Technology (China))
IEEE Transactions on Components Packaging and Manufacturing Technology
July 13, 2017
Cited by 160
Related Papers
Towards single molecule switches
|Chemical Society Reviews|2015|387
Assembling molecular Sierpiński triangle fractals
|Nature Chemistry|2015|364
Thiol‐Branched Solid Polymer Electrolyte Featuring High Strength, Toughness, and Lithium Ionic Conductivity for Lithium‐Metal Batteries
|Advanced Materials|2020|297
Ultra high-strength Mg–Gd–Y–Zn–Zr alloy sheets processed by large-strain hot rolling and ageing
|Materials Science and Engineering A|2012|263
Unraveling Charge State of Supported Au Single-Atoms during CO Oxidation
|Journal of the American Chemical Society|2018|246