Reliability of Fan-Out Wafer-Level Heterogeneous Integration
John H. Lau(ASM Pacific Technology (China)), S. W. Ricky Lee(University of Hong Kong), Rozalia Beica(Dow Chemical (United States)), Henry Yang, Ning Cheng Lee(Indium Corporation (United States)), Kai Wu(King University), Yiu‐ming Cheung(Hong Kong Baptist University), Xi Cao(Huawei Technologies (China)), Iris Xu, Penny Lo(ASM Pacific Technology (China)), Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), Mian Tao(Hong Kong University of Science and Technology), Margie Li(ASM Pacific Technology (China)), Ming Li(Wuhan University), Yuhua Chen(Micron Corporation (United States)), Li Zhang(Royal Holloway University of London), Nelson Fan(ASM Pacific Technology (China)), Tony Chen(Hospital for Special Surgery), Yang Lei(ASM Pacific Technology (China)), Cheng-Ta Ko, K. H. Tan, Zhong Cheng(Huawei Technologies (China)), Jeffery C. C. Lo(Hong Kong University of Science and Technology)
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