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Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)John H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2017Cited by 40
Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2018Cited by 25