Fan-Out Wafer-Level Packaging for Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Iris Xu et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2018Cited by 87
Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn H. Lau, S. W. Ricky Lee, Ming Li et al.|Journal of Microelectronics and Electronic Packaging|2018Cited by 25